Challenge
Cleaning ceramic components used in semiconductor manufacturing poses unique challenges, especially when corrosive chemicals and high heat are involved. The customer required a solution that could withstand prolonged exposure to sodium hydroxide and effectively eliminate metallic residues such as aluminum and gallium. Traditional methods were either inefficient or unsuitable for use at the required temperature and chemical concentration. In addition, any solution needed to be tailored to the customer’s process flow and cleanliness requirements without compromising the ceramic components’ structural integrity.
Approach
To develop an effective solution, Better Engineering followed a comprehensive approach centered on three pillars: rigorous testing, close customer collaboration, and innovative engineering.
Extensive laboratory testing formed the foundation of the project. Different cleaning methods were evaluated to determine their effectiveness in removing aluminum and gallium contaminants from ceramic parts. These tests were critical in understanding the chemical interactions and setting performance benchmarks for the system.
Customer collaboration was a core part of the process. Engineering and sales teams worked directly with the manufacturer to understand the application’s exact requirements. These discussions offered insight into both operational needs and user expectations, helping to shape the design of a tailored solution.
Building on this groundwork, Better Engineering developed a custom washer with a three-tier configuration. The washer utilized spray cleaning to maximize contact with all semiconductor component surfaces. The system was engineered with multiple cleaning stages, recirculating wash, rinse, fresh rinse, and a heated dry cycle, all built to maintain 190°F throughout and to handle the caustic environment with high reliability and durability.
Results
The final part washing system delivered consistent and effective removal of aluminum and gallium contaminants, maintaining optimal performance even under high-temperature and chemically aggressive conditions. The use of both immersion and spray mechanisms ensured uniform cleaning of the complex ceramic geometries. Thanks to close collaboration, the cleaning process aligned precisely with the customer’s manufacturing workflow, increasing both throughput and product quality. The project demonstrated how custom engineering and in-depth customer engagement can lead to a solution that outperforms conventional methods in demanding environments.
Conclusion
By integrating rigorous testing, direct customer input, and advanced engineering, Better Engineering successfully developed a cleaning system tailored to the unique cleaning needs of ceramic semiconductor components. The result was a solution that met stringent chemical and thermal requirements while delivering consistent and reliable cleaning performance. This case study reflects the value of cross-functional collaboration and customized design in overcoming complex manufacturing challenges.
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